Internships

One of CITC’s core values is providing access to education. Education and training are key to securing the future of the semiconductor industry in Europe. In close cooperation with companies and educational institutes, CITC organizes targeted education and training for young talent. By providing a connection between education and industry, we contribute to the training and skills of people who match industry needs.

Student opportunities

CITC holds an Accredited Work Placement Company qualification that enables us to train secondary vocational education (mbo) students in professional practice.

With our close ties to educational institutes like Radboud University, Delft University of Technology, Eindhoven University of Technology, University of Twente and HAN University of Applied Sciences, we regularly offer internships (BSc and MSc), graduation assignments (BSc and MSc) and PDEng/PhD projects to students.

Internships or graduation assignments at CITC can last 3-9 months, the location is Nijmegen.

Check if you’re a match for CITC

Are you a motivated and enthusiastic student in one of the following fields:

Electricial engineering
Mechanical engineering
Applied physics
Material Science
International Business

Seondly, are you willing to work in the semiconductor packaging field in a highly dynamic environment at the intersection of science and industry?

And, finally, are you interested in developing novel semiconductor packaging concepts?

If this is a triple ‘YES’, please contact us. We might be looking for you!

Current opportunities

Master thesis project: Sub-mm printing process evaluation of copper sinter paste for copper pillars on all printed SMD components

There is an industrial interest to lower the costs of current manufacturing processes for printed SMD components. Through printing, resistive elements can be produced but the challenge remains with bumping. Replacing expensive metallization processes with printed copper pillars can potentially reduce product costs, processing steps, and facilitates flip-chip bonding.

Copper sintered pillars favor soldering unlike silver which suffers from diffusion of solders. Your assignment consists of an investigation of different processes for printing different sizes of copper pillars that are compatible with various SMD codes.

Internship assignment: On the influence of additives in a sintered silver microstructure on the thermal and electrical conductivity

The semiconductor packaging industry has been looking for lead-free alternative solutions for die attachments especially for high-power packages. One alternative, pressureless silver sinter interconnect, appears to be too brittle. The research question of this assignment is: can additives reduce brittleness and what are the optimal shapes and sizes of such additive materials to improve conductivity and still maintain similar mechanical properties?

Internship assignment: Video communication (in Dutch)

Within our content marketing an essential part is missing: video. Although we have a corporate film, we are convinced that other forms of video content – from trade fair presentation to vlog – can be of value to CITC. The main task of the intern we are looking for is to map out the possibilities of video communication for CITC.

Interested in an assignment at CITC?

To learn more about what CITC can offer you, please fill in the student contact form.