Certificates for Semiconductor Packaging minor students
January 25, 2025 – CITC celebrates the International Day of Education together with the students who finished their Semiconductor Packaging minor this week. Congratulations to all of you – your hard work on the CITC, NXP Semiconductors and ASMPT ALSI assignments has paid off. Best of luck with the rest of your education and perhaps we will see you again, as an intern or colleague.
Minor student becomes intern
One of the students, Alex Harper, soon returned to CITC as an intern. In the coming months, he will be working on slit nozzle dispensing. His assignment focuses on the design of the nozzle and process research. For those who like to have a little background on this topic: current slit nozzles that are commercially available are relatively expensive and have a long lead time of 2-3 months. CITC worked on an alternative design (patent pending) which differs from other nozzles in that the design is flexible.
Iterations in both dispense volume and shapes are easy to make. Production is done with 3D printing, which is cheap and makes the nozzles disposable. Alex will work on improvements to the current design and define process parameters – one cannot exist without the other.