CITC results infographic 2024 available

April 10, 2025 – CITC is pleased to present its annual infographic. 2024 was a year full of firsts an special moments for CITC. We realized growth in office and lab space by moving to our new accommodation. We held our first Innovation Day. And last, but certainly not least: our program lines featured several innovations, all firsts in their field.

Innovation

Innovation is at the heart of CITC’s existence. In our four program lines we work on developments that contribute to solving societal challenges.

• Thermal high-performance management: high-power semiconductors are a key ingredient in our energy transistion. They will help to maintain and improve our modern and comfortable living standards. Their role in the fight against the climate crisis is crucial; they will help countries achieve their carbon neutrality targets. In 2024, CITC developed its first lead-free clip attached high-power device.
• RF and mmWave chip packaging: these chips enable the next generation of high-frequency applications. Future communication networks must be even faster, more reliable and more secure than current networks, and preferably made in Europe. Within the research and development of the next generation of communication networks, in particular 6G, CITC developed its first fan-out package in 2024.
• Integrated photonics packaging: photonic chips offer new and unique solutions where current conventional technologies reach their limits in terms of speed, capacity and accuracy. Integrated photonics packaging enables low-cost and high-volume photonics packages that can be used in applications such as data and telecom, AI, agrifood, healthcare and mobility. In 2024, CITC developed its first ultra-low loss interconnect.
• Advanced additive manufacturing packaging: our most promising and disruptive technology development enables an advanced ultra-low-cost and sustainable packaging platform – competitive sustainable advanced packaging (CSAP). CITC developed the first CSAP demo in 2024, which will be a key ingredient for creating an economically attractive proposition for investments in advanced packaging production in the Netherlands and the EU, while offering an environmentally friendly alternative.

Infrastructure

Our new location offers enough space for several newly acquired machines. Most notable were the Boschman molding machine and the Finetech Femto 2. The molding machine offers us the possibility to carry out the last step in the production process in-house. This allows the packaging solution we develop to be fully tested for reliability and consistency. The Finetech advanced sub-micron bonder is a versatile machine with a very well-defined process control. This makes it suitable for both classic and advanced packaging applications.

On September 25, mayor Bruls of Nijmegen officially opened the new CITC accommodation. In tribute to our late founder and first general manager, the new lab has been named the Barry Peet lab.

Education

CITC works with educational institutions and industry to ensure that talent is given sufficient opportunities to develop the skills that are in demand in the industry. Talent is not age-related and that is why we focus on all levels of education. We help to create enthusiasm for STEM by giving children the opportunity to try things out for themselves during events.

We offer older students opportunities to participate in guest lectures, practical assignments or internships. And finally, we offer formal education to bachelor students and industry professionals in our accredited Semiconductor Packaging University Program.

Jibran Ahmed Khan from Hochschule Rhein-Waal followed the CITC Semiconductor Packaging minor and then did his bachelor thesis work at CITC: “This email is to inform you that I graduated with a very good grade for my final thesis and colloquium. I am very thankful to CITC for offering such a wonderful opportunity”.

In conclusion

Since our foundation over 5 years ago, CITC has taken significant steps in realizing its ambition to become a leading partner in semiconductor and photonics packaging. In the coming years, we will continue our research work to reduce the cost of advanced packaging and thus make a major contribution to the return of the packaging industry to the EU.

We will continue our efforts to put CITC and Nijmegen on the European chip technology innovation map. By becoming a strong research institute with education and training as part of the offer, we will contribute to making the region more attractive to major investors.

Downloads

CITC 2024 results infographic (EN)
CITC 2024 results infographic (NL)