Publications

2025

On the pronounced mode dependency of the interface fracture toughness of pressureless sintered silver interconnects: Identification of dissipative micro-mechanisms
Engineering Fracture Mechanics

2024

Prognostic Monitoring of Power QFN Packages With Silver Sintered Die-Attach Materials
IEEE Transactions on Components, Packaging and Manufacturing Technology

Advancing the semiconductorisation of photonic chip packaging
Photonic Integrated Circuits

Novel 3D Printed Electronics Technology Assessment for RF Applications
42nd ESA Antenna Workshop − Antenna Technologies for Future Space Missions, 11-15 November 2024, Noordwijk, The Netherlands

Additive Fan-Out Panel-Level Processing of MOSFET Devices
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin, Germany, 2024, pp. 1-6

Exploring the process-microstructure-thermal properties relationship of resin-reinforced Ag sintering material for high-power applications via 3D FIB-SEM nanotomography
Materials & Design

Thermal characterization methodology for thin bond-line interfaces with high conductive materials
Thermal Science and Engineering Progress

A 2-Tier TRL Calibration Technique to Assess Flip-Chip Interconnects at D-Band
2024 103rd ARFTG Microwave Measurement Conference (ARFTG), Washington, DC, USA, 2024

An Analytical Model Describing Residual Stresses in Thin Die Attach Layer
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

An Outlook on Power Electronics Reliability and Reliability Monitoring
Recent Advances in Microelectronics Reliability (chapter in book, p. 251-282)

Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment
IEEE Transactions on Power Electronics

2023

Improving Semiconductor Reliability of Silver Sintering Die-Attach Adhesives for Large Die on Copper Lead Frames
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2022

Characterization of the Dielectric Properties of Commercially Available Low-loss UV-curable Resins from 60 GHz to 90 GHz 2022 52nd European Microwave Conference – EuMC

In-situ reliability monitoring of power packages using a Thermal Test Chip
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems – EuroSimE