Electronics System-Integration Technology Conference
From September 11-13, the 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) will take place. The event is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS Europe. This year’s conference will be held in Berlin, Germany.
CITC’s Francesca Chiappini is one of the speakers at the conference. On Friday, September 13, she will talk about the paper ‘Additive fan-out panel-level processing for power MOSFET devices’. If you would like to attend her presentation, please go to session AP9, location MOA5 from 13:45 hrs – 14:10 hrs.
More information about the event
Side event
Francesca will also attend one of the conference’s side events: the 3rd EuroPAT-workshop ‘Semiconductor Packaging Manufacturing in Europe – Growing or Vanishing?’ This will be held from September 9-10. It is organized by SEMI Europe.