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Partners

Evolving chip technology is not a one-man business. Collaboration is vitally important in innovation. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging…

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Pressureless sintering die attach News

CITC and Henkel forge partnership to accelerate high-thermal die attach solutions

…profit of about 2.7 billion euros. Henkel employs about 53,000 people globally – a passionate and highly diverse team, united by a strong company culture, a common purpose to create…

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Close up of an acoustic microscope News

CITC intensifies cooperation with PVA TePla

…of energy, photovoltaics, and environmental technology. https://www.pvatepla.com/en *** Contact CITC: Marco Koelink | M +31 6 15 15 66 41 | E marco.koelink@citc.org PVA TePla: Peter Czurratis | M +…

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Semiconductor Packaging University Program

Together with HAN University of Applied Sciences, CITC developed the Semiconductor Packaging University Program. The program provides a connection between education and industry and as such contributes to the training…

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CITC and AntenneX join forces News

CITC and AntenneX join forces to characterize antenna-in-package applications at mmWave frequencies

…wireless communication, the next generation communication standard (6G) is set to operate at frequencies around and above 100 GHz. From an electronic packaging point of view, this means a widespread…

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Thermal High-Performance Packaging

The transition to Wide-Band-Gap (WBG) for many applications has increased the power generation by semiconductor devices. In combination with miniturization, this results in higher die temperature and higher thermomechanical stresses….

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Integrated Photonics Packaging

Photonic Integrated Circuits (PICs) are an emerging technology in data communications, optical computing and sensing. In our Integrated Photonics Packaging program, we support customers with their chip packages and develop…

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Female scientist proudly standing for her research paper News

Paper on the Characterization of the Dielectric Properties of Commercially Available Low-loss UV-curable Resins from 60 GHz to 90 GHz

…3D printing are suitable for mmWave application and thus can be used in the development of e.g. antennas or packaging. Interested in the complete results? Download paper   Innovation meets…

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Privacy policy

…or otherwise complying with applicable data protection laws. 12. Updates to this policy In order to stay compliant with applicable legal requirements, we will review and/or may modify this privacy…

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