…packaging and systems integration. Their cooperation with semiconductor companies and universities provides us with an excellent research platform for defining our future roadmap for the next generation of acoustic microscopes.”…

…tests for packaging components is essential in reliability engineering. The thermo-mechanical cycling lifetime (TMCL) testing framework allows CITC to rigorously evaluate the durability and long-term performance of micro and power…

…of actively measuring the thermal performance of a package during lifetime testing. A Thermal Test Chip (TTC – depicted above) assembled into a Power Quad Flat No-lead (PQFN) package was…

…first internship: two days per week. Nils had no expectations beforehand, but Ted was pleasantly surprised. “I had expected a very strict work environment compared to school, but that was…

…wireless communication, the next generation communication standard (6G) is set to operate at frequencies around and above 100 GHz. From an electronic packaging point of view, this means a widespread…

…they worked on in the CITC laboratories and successfully defended their work. Open laboratories Although the students attended the third edition of the minor, they were the first to fully…