The transition to Wide-Band-Gap (WBG) for many applications has increased the power generation by semiconductor devices. In combination with miniturization, this results in higher die temperature and higher thermomechanical stresses….
…as demo and application lab for new types of equipment and materials. It is also available to third parties to enable them to develop, test and implement new packaging solutions….
…to talk to everyone. The colleagues were open and very welcoming. What I also liked is that everyone is open to each other’s work. Over lunch, we had broad conversations,…
CITC works on technology that helps to provide answers to societal challenges. We focus on the following application domains: energy, mobility, communication, care and agro/food.
Photonic Integrated Circuits (PICs) are an emerging technology in data communications, optical computing and sensing. In our Integrated Photonics Packaging program, we support customers with their chip packages and develop…
…creates opportunities for new packaging concepts with increased design freedom and reduced manufacturing complexity. CITC’s Additive Packaging Manufacturing program focuses on applications that cannot be realized using traditional manufacturing technologies….
…things out. We started designing a PCB and we were allowed to have test pieces made.” Despite the freedom there was obviously supervision. “We could always ask questions,” says Matteo….
…contribute to the future of the semiconductor industry in Europe. Please feel free to contact us if your school is also interested in a CITC guest lecture or company visit….
