Additive Packaging Manufacturing
New technologies offer revolutionary opportunities in semiconductor packaging. CITC and its partners are proud to introduce the Competitive and Sustainable Advanced Packaging (CSAP) concept.
CSAP proof of concept: first functional fully printed package of MOSFET
Competitive
CSAP offers a groundbreaking technology for cost reduction:
- Replacing slow serial process steps with fast batch processes
- Enabling a dramatic reduction of package cost and capital expenditure
Sustainable
Additionally, CSAP is a packaging technology that eliminates:
- Highly polluting process steps in today’s advanced packaging such as resist stripping and copper etching
- The need for toxic materials in today’s classical packaging such as Pb solders and PFAS
Height plot
CSAP process characterization
Encapsulation
- Encapsulation and via forming our in one printing step
- Small, large vias and patterning of EMC can be formed in same printing step
- EMC material properties define printing resolution: 65 μm vias are demonstrated
Metallization
- Additive metallization
- Seed layer printing
- (Electro)plating of seed layer
- Different inks tested as sees layer and different Cu plating conditions are investigated
- Cu layers of 15 μm thickness can be grown on top of printed seed layer, thicker plating is under investigation
Further development is needed to optimize material and processes.
Resolution RDL L/S scaling versus cost
CSAP application, cost and environmental considerations
As demonstrated in the graph on the right, CSAP targets relatively large packages as used in among others power devices and RF microcontrollers. CSAP offers an attractive alternative to established fan-out technologies for applications that do not require a very high resolution.
Additional considerations
- Design flexibility and lower tooling costs
- CSAP enables lower package cost solutions than FO-PLP
- Lower CAPEX needed for production; screen printers instead of litho and compression molding tools
If you want to go fast, go alone.
If you want to go far, go together – African proverb
The power of collaboration made it possible to come up with the concept of Competitive Sustainable Advanced Packaging. In addition to CITC, TNO, Holst Centre, and Henkel were involved. The research was supported by the National Growth Fund through the Dutch 6G flagship project ‘Future Network Services’.
