Integrated Photonics Packaging
Photonic Integrated Circuits (PICs) are an emerging technology in data communications, optical computing and sensing. In our Integrated Photonics Packaging program, we support customers with their chip packages and develop new packaging concepts.
We aim to ‘semiconductorize’ the integrated photonics industry. We do this by using our expertise and knowledge in the field of high-power electronics packaging and RF packaging to develop packaging technologies that address the following topics:
- Fiber-to-chip coupling
- Chip-to-chip coupling
- High-density electrical and optical interconnections
- Hybrid integration of photonics chips
- Multi-chip module in which photonics and electronics are integrated in a single package
- Thermal management
Read more about semiconductorization of photonics chip packaging here
Heterogeneous and hybrid integration
Packaging and assembly technologies are critical to making devices available for high-volume, low-cost applications. This includes heterogeneous and hybrid integration: the dense integration of compound semiconductor photonics and silicon microelectronics. It enables significant reductions in system size, weight and power, while delivering performance improvements and new functionality.
Specifically, the combination of photonics with microelectronics is an important factor for smarter photonics and faster electronics. It is crucial for new applications in e.g. the automotive, medical, optical computing and data communications fields.
6-axis active alignment: PI Nanocuble on Etteplan platform
State-of-the-art infrastructure
CITC has a state-of-the-art assembly facility for active and passive alignment for photonic devices. This is further complemented with advanced semiconductor capabilities, such as:
- Die attach by dispensing either (conductive) adhesive, solder or sinter die attach materials
- (RF) wire bonding, adhesive bonding, soldering and sintering capabilities
- Flip chip bonding
- Die attach underfill
Working with CITC
- We are experienced in both semiconductor and photonics packaging, which includes e.g. thermal optimization and RF
- We provide you with all results in process development, process optimization and statistical process control
- We participate in research programs, e.g. in defining new standards in photonic packaging
CITC photonics ecosystem
Evolving photonics technology is not a one-man business. Collaboration is vitally important in innovation. CITC therefore collaborates with several organizations such as:
- PhotonDelta, a Dutch foundation stimulating business and science in photonics
- Photonic Integration Technology Center (PITC), an innovation center accelerating integrated photonics by bridging the gap between research and application
- European Photonics Industry Consortium (EPIC), the world leading industry association that promotes the sustainable development of organizations working in the field of photonics in Europe
We are also active in the Dutch Growth Fund related to Photonics. Within this project, we develop future packaging solutions to reduce packaging costs and improve performance.