Successful first CITC Innovation Day
October 2, 2024 – On September 25, we welcomed almost 90 people to our first CITC Innovation Day. Together with our partners Delft University of Technology and Holst Centre we updated the audience about the latest developments in chip packaging.
Keynote speakers
After two keynote speeches in the morning by Kouchi Zhang – ‘Heterogenous system integration and packaging – the key success factor of semiconductors in EU’ and Jaap Lombaers – ‘Chip integration – sexy again and in need of innovation’, we had 8 innovation pitches and a poster market in the afternoon.
Innovation pitches
For those interested in the topics of the innovation pitches:
- Edsger Smits (CITC) – ‘Package development for power: towards green and efficient electronics’
- Sander Dorrestein (CITC) – ‘How CITC semiconductorizes integrated photonics assembly and packaging’
- Gerwin Gelinck (Holst Centre/PITC) – ‘Introducing Photonic Integration Technology Centre’
- Henk van Zeijl (TU Delft) – ‘The Fabric of Chip Integration Technology’
- Francesca Chiappini (CITC) – ‘Technologies for Antenna-in-Package at CITC’
- Gari Arutinov (Holst Centre) – ‘Laser processes for microLED integration: Die Transfer | Bumping | Repair’
- Hylke B. Akkerman (Holst Centre) – ‘3D structural microelectronics by additive manufacturing’
- Mark Luke Farrugia, PMP (CITC) – ‘Competitive and Sustainable Advanced Packaging – CSAP’
It was a pleasure to have you all at the Noviotech Campus and we hope to see you again in two years!